Tier One Semiconductor Company Testimonials
During the last 3 years, our group has developed its first SoC using TSMC 16FFC, targeting challenging industrial and automotive markets.
AAI was selected to be our design partner for bringing RTL to GDSII.
AAI has good reputation in Israel as leading design house with great expertise in advanced process nodes, familiarity with all Silicon lifecycles, stable CAD flows and skillful engineering team and the reputation to deliver.
Our SoC came back and its ramp time and results, both functional and in production tester were very good so far, which supports our design house selection.
AAI shall be a leading candidate as design house for any future project in our roadmap.
Haran Elik
Director HW development ICG
Celeno Testimonials
We (ex-Celeno) did 3 projects with AAI in below technologies:
- 40nm
- 14nm
- 28nm
All 3 projects are for wireless communication chips.
Project size vary from few millions’ gates to few 10’s of millions gates
In all 3 projects meeting timing was a challenge and required using overdrive and LVT/SLVT cells
For all 3 projects AAI performed RTL2GDS including
- DFT (MBIST, BSCAN, SCAN) including
- MBIST and BSCAN controller implementation
- MBIST+repair using OTP
- Test controller
- SCAN insertion including coverage improvement
- MBIST, BSCAN and ATPG vector creation
- MBIST, BSCAN and ATPG vector debug on tester
- Physical design including
- Digital and analog-IP integration
- IO design
- ESD design
- Floorplan including PAD/Bump and power grid insertion
- Synthesis
- P&R including routing of special signals, ECO-cells and DECAP insertion
- Formal verification (equivalent check)
- Timing closure including signal integrity (meeting signoff recommendation)
- Power, IR-drop and Elector-migration analysis and optimization (meeting signoff recommendation)
- DFM & Physical verification (meeting signoff recommendation)
- ESD verification (meeting signoff recommendation)
- Package netlist + package reference design according to OSAT design rules
AAI team is highly professional and highly motivated, throughout the projects AAI showed high level of commitment.
Schedule was always met for MPW tapeouts and had some (reasonable) slippage for full-mask tapeouts
All chips came out working 1st time (no mask retrofit was required)
Happy to give more details if required
Amir Freizeit
VP IC-Engineering
Celeno wireless communication
Mobileye Testimonials
Major IPs: 2 ARM946 cores with 16KB I-Cache and 16 KB D-Cache, PLL, SDRAM controller, DMA controller, CAN controller, I2C controller and more
Technology: TSMC 0.18u, 6LM
Performance: 110 Mhz
Package: 292 HSBGA
NXP Testimonials
Samsung Testimonials
"We deeply appreciate that you overcame all obstacles to success and completed a task of great difficulty with a flash of wit and so eventually contributed to a great successful demonstration in APEC 2005 Korea. We wish your company's eternal development and prosperity, and we also pour our whole heart in this plaque of appreciation. Samsung Electronics".